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Layer 5 of 7

Foundry & Advanced Packaging

Every AI chip is born in a fab. TSMC controls the global flow.

$150B
Market Size
15% CAGR
Growth Rate
7
Companies

ssr.aiMoneyFlow.whyMoneyFlows

Leading-edge nodes (3nm, 2nm) require $20B+ fabs. Only 3 companies can manufacture frontier AI chips.

ssr.aiMoneyFlow.investorAngle

TSMC's 3nm wafer ASP is $20K+. Advanced packaging (CoWoS) is the new constraint.

Companies in This Layer

TSMASMLAMATLRCXKLACAMKRINTC
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